Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo Mechanical Stresses

Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias

The advancement of area-array packages, such as flip chips and chip scale packages, has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a smaller footprint area. HDI substrates and printed circuit boards use microvias as interconnects between conductor layers. HDIs have evolved from single-level microvias to stacked microvias that travers...

Theoretical and Practical Aspects of Thermo Mechanical Reliability in Printed Circuit Boards with Copper Plated Through Holes

The thermo mechanical reliability of copper plated through holes (PTH) in printed circuit boards is normally determined by different tests e.g. thermo cycle test (TCT), interconnect stress test (IST) or highly accelerated thermal shock (HATS). During these tests the plated copper is exposed to stresses and strains which are below the tensile strength and the fracture strain, respectively, which...

Reliability of PWB Microvias for High Density Package Assembly Body of Knowledge (BOK)

Reliability Testing for Microvias in Printed Wire Boards

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) t...

Testing and Reliability Improvement of High Reliability Consumer Electronics Products Manufactured on Printed Circuit Boards

The design and development of reliable electronic systems is a highly challenging task. In this paper we present the results of research carried out in order to improve the reliability of the printed circuit boards of a high reliability electronic consumer product manufactured locally by the application of accelerated life testing and interconnect stress testing. Reliability improvement is a ma...